NR9-250P
Negative Resist NR9-250P is a negative tone photoresist designed for 366 nm wavelength exposure,
using tools such as wafer steppers, scanning projection aligners, proximity printers and contact
printers.
These are the advantages of NR9-250P over other resists:
- superior resolution capability of less than 0.5 μm
- fast develop time
- fast photospeed
- superior adhesion capability
- easy resist removal in Resist Remover RR4
- shelf life exceeding 3 years at room temperature storage.
The formulation and processing of NR9-250P were designed with regard to occupational and
environmental safety. The principal solvent in NR9-250P is cyclohexanone and development of
NR9-250P is accomplished in a basic water solution.
Properties
♦ Solids content (%): 9-12
♦ Principal solvent: cyclohexanone
♦ Appearance: light yellow liquid
♦ Coating characteristic: very uniform, striation free
♦ Film thickness information:
Coating spin speed,
40 s spin (rpm)
Film thickness after 150°C hotplate
bake for 60 s (nm)
800 400-600
3000 220-280
♦ Sensitivity at 365 nm exposure wavelength (mJ/cm² for 1 μm thick film): 21
♦ Guaranteed shelf life at 25°C storage (years): 3
Processing
1 Application of resist by spin coating at selected spin speed for 40 s.
2 70°C hotplate bake for 180 s. (softbake).
3 Resist exposure with a tool emitting 365 nm wavelength.
4 100°C hotplate bake for 60 s. (post-exposure bake).
5 Resist development in Resist Developer RD6/water 3:1 by spray or immersion. Development
time for 0.25 μm thick film, for example, is 10 s.
6 Resist rinse in deionized water until water resistivity reaches prescribed limit.
7 Drying of resist.
8 In applications when NR9-250P pattern becomes a part of device structure, 250°C hotplate
bake for 12 minutes is recommended to render NR9-250P pattern insoluble in common solvents.
9 Removal of resist in Resist Remover RR4 if procedure requires it.
Note: The above procedure refers to substrates, which are good conductors of heat such as
silicon, GaAs etc. Bake times need to be increased by a factor of 3.5 for substrates that are
poor conductors of heat such as glass.
Handling Precautions
Negative Resist NR9-250P is a flammable liquid. Handle it with care. Keep it away from heat,
sparks and flames. Use adequate ventilation. It may be harmful if swallowed or touched. Avoid
contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves and protective
coating.