NR9-500P
Negative Resist NR9-500P is a negative tone photoresist designed for 365 nm wavelength exposure,
using tools such as wafer steppers, scanning projection aligners, proximity printers and contact
printers.
These are the advantages of NR9-500P over other resists:
-superior resolution capability of less than 0.5 μm
-fast develop time
- fast photospeed
-temperature resistance of up to 100°C
-superior adhesion to substrates without a primer
-easy resist removal in Resist Remover RR4
-shelf life exceeding 3 years at a room temperature storage.
The formulation and processing of NR9-500P were designed with regard to occupational and
environmental safety. The principal solvent in NR9-500P is cyclohexanone and development of
NR9-500P is accomplished in a basic water solution.
Properties
♦ Solids content (%): 11-15
♦ Principal solvent: cyclohexanone
♦ Appearance: light yellow liquid
♦ Coating characteristic: very uniform, striation free
♦ Film thickness information:
Coating spin speed,
40 s spin (rpm)
Film thickness after 100°C hotplate
bake for 60 s (nm)
1000 780-880
2000 540-640
3000 450-550
♦ Sensitivity at 365 nm exposure wavelength (mJ/cm² for 1 μm thick film): 21
♦ Guaranteed shelf life at 25°C storage (years): 3
Processing
1 Application of resist by spin coating at selected spin speed for 40 s.
2 Start dispensing Edge Bead Remover EBR2 simultaneously on top and bottom surface of
spinning coated substrate through nozzles 0.5-1.0 cm from an edge of a substrate as soon as edge
bead forms (3-5 s after ceasing resist dispense). Stop dispensing EBR2 5 minutes prior to
completion of spin coating cycle.
3 150°C hotplate bake for 60 s. (softbake).
4 Resist exposure with a tool emitting 365 nm wavelength.
5 100°C hotplate bake for 60 s. (post-exposure bake).
6 Resist development in Resist Developer RD6 by spray or immersion.Development time for
0.5 μm thick film, for example, is 8 s.
7 Resist rinse in deionized water until water resistivity reaches prescribed limit.
8 Drying of resist.
9 Removal of resist in Resist Remover RR41 at 110°C.
Note: The above procedure refers to substrates that are good conductors of heat such as silicon,
GaAs etc. Bake times need to be increased 3.5 times for substrates that are poor conductors of heat
such as glass.
Handling Precautions
Negative Resist NR9-500P is a flammable liquid. Handle it with care. Keep it away from heat,
sparks and flames. Use adequate ventilation. It may be harmful if swallowed or touched. Avoid
contact with liquid, vapor or spray mist. Wear chemical goggles, rubber gloves and protective
coating.
